Cadence 以Integrity 3D-IC平台為基礎,提供全新的設計流程,支援台積公司 3Dblox™ 標準
26 Apr 2023 重點提示: Cadence Integrity 3D-IC平台,為所有最新台積電3DF […]
♦EDA tool solutions from system level, RTL, to GDSII, to manufacture, and to PCB
♦Software, middleware and silicon IP solutions, from multimedia and communication application to fundamental building libraries, memories and macros.
♦Integrated EDA and IP as the value up solutions through professional consulting and services.